Wireless Memory System Combines Low-Cost Storage, Code

Booth #5058K

Intel has unveiled its StrataFlash Wireless Memory System, a complete, cost-effective memory solution specifically designed for next-generation handsets that require memory storage for large embedded data applications such as camera images, audio, and video files.

Based on the company's Multi-Level Cell (MLC) technology, which doubles the amount of information stored in each memory cell, the system contains code execution, data storage and RAM working space - three types of memory functionality wireless developers require.

The system also features 1.8-volt operation for longer battery life and memory densities up to 1GB. It comes in one tiny package that simplifies the design process for wireless handset makers.

The system is the latest member of the stacked chip scale packaging (stacked-CSP) product line. By offering a common package pin out and the same Intel Flash file management software across a range of densities, integration and upgrades are easily made.

The product provides new levels of space savings for wireless customers by combining high-density Intel StrataFlash Wireless Memory with flexible RAM options in densities up to 1GB in a small package size of 8x11mm.

The system (part number LV18/LV30) is currently sampling, with production volumes starting in February. Pricing will vary by specific flash and RAM memory combinations.

Intel Corp.
800-628-8686